Dear valued customer,
ATP’s latest line of e.MMC devices built on 3D triple level cell (TLC) NAND use a new die package to deliver long-life performance, optimized power consumption and customizable configuration options.
• E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND
• E650Si/Sc Series in native TLC has near-MLC endurance
The E750Pi and E650Si Series are industrial temperature-operable (-40°C to 85°C), making them ideal for deployment in scenarios with extreme thermal challenges and harsh environments, while E750Pc and E650Sc support -25°C to 85°C operating temperatures for applications with non-critical thermal requirements.
To help you learn more about the new e.MMC offerings, we have created the following materials. These are now available on the ATP website.
To access, simply click the hyperlinked text below to be directed to the specific URL.
• Press release: “New Die Package Extends 3D TLC Endurance of ATP E750Pi/Pc, E650Si/Sc Series e.MMC to SLC/MLC Levels; Customizable Configurations Offer Greater Flexibility in Diverse Application Requirements”
• ATP E750Pi/Pc and E650Si/Sc Series product page
• Product flyer with product specifications |
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